TSMC to Adopt ASML High-NA EUV Lithography Machines in Mass Production Starting in 2030

ChainCatcher report: On September 8, TSMC announced it will adopt ASML’s new “high-NA” extreme ultraviolet (EUV) lithography machines from the Netherlands in mass production starting in 2030. On the same day, both companies stated they will collaborate on an industry-wide initiative to improve high-NA machines. ASML holds a monopoly on EUV lithography machines used to form nanoscale ultra-fine circuits and began shipping high-NA machines capable of patterning finer circuits in December 2023. Intel has already adopted high-NA machines, while TSMC previously delayed mass adoption due to high costs and other factors. TSMC and ASML will launch an industry-wide project to enlarge the size of photomasks—the original templates for circuits—from the current 6-inch (approximately 15 cm) square to a 12-inch square, and develop high-NA machines and related components compatible with these larger masks. A pilot production line for large masks is planned to be established by 2031, with high-NA machines compatible with large masks expected to be ready for advanced semiconductor manufacturing by 2033. Major semiconductor manufacturers and mask companies have already expressed interest in participating. While high-NA machines can pattern finer circuits, their single-exposure area is reduced to half that of traditional machines, requiring multiple exposures for large chips, which complicates the process and increases costs. Enlarging the photomask will expand the exposure area and reduce costs. On the same day, TSMC’s Chairman and CEO, C.C. Wei, stated that the company will consolidate industry-wide expertise to continuously drive technological innovation that enables broader adoption of advanced technologies and delivers their benefits.