ChainThink reports, according to The Information, two sources said TSMC is considering entering the advanced memory chip manufacturing sector and has begun planning the production of 3D DRAM in response to NVIDIA's demands.
3D DRAM increases capacity by vertically stacking memory cells, unlike traditional DRAM, which places memory cells in a single layer. Currently, Samsung Electronics, SK Hynix, and Micron Technology dominate memory chip manufacturing and are all developing 3D DRAM technology.
AI hardware demands are straining memory chip supplies and driving price increases, prompting chip design companies like NVIDIA and Apple to seek additional sources. Apple raised device prices earlier this year due to rising memory costs.
