IT Home, September 28 — According to Taiwan’s Economic Daily, industry sources indicate that major clients have increased their orders for TSMC’s 2nm family capacity by 10% to 20%; in response, TSMC is accelerating its expansion of 2nm capacity, with overall progress exceeding expectations.
The market had generally anticipated that TSMC’s monthly 2nm capacity by the end of this year would be approximately 90,000 to 100,000 wafers, with the potential to reach 110,000 to 140,000 wafers by 2027.
However, according to industry sources, TSMC is further accelerating its capacity expansion due to surging customer demand for additional orders, aiming to reach a monthly capacity of 120,000 wafers by the end of this year, potentially bringing forward its original 2027 capacity target.
Sources reveal that TSMC has set new records in both the speed and scale of ramping up new capacity across its entire 2nm family to meet strong customer demand, far exceeding the first-year capacity ramp of its 3nm family.
IT Home noted that Hou Yongqing, Senior Vice President of R&D at TSMC, stated at this year’s TSMC North America Technology Forum that, due to strong demand from AI and other sectors, this year will mark the first time five 2nm wafer fabs will simultaneously ramp up production.
Hou Yongqing noted that TSMC’s first-year wafer output for its 2nm process increases by 45% compared to its first-year wafer output for the 3nm process in 2023; the compound annual growth rate for 2nm capacity from 2026 to 2028 will reach 70%. Additionally, TSMC will continue to expand its 3nm capacity.