SK Hynix Launches R&D on 3D Stacked DRAM for Edge AI Storage

iconKuCoinFlash
Share
AI summary iconSummary
SK Hynix is advancing R&D on 3D stacked DRAM for edge AI storage in partnership with MetaEra. The company is hiring design engineers in the U.S. and plans to co-develop the technology with clients. This on-chain news underscores a key trend in AI and crypto developments, as the stacked memory is poised to enable edge AI in the post-generative AI era. The design stacks memory directly onto logic chips to enhance performance for next-generation AI devices.
ME AI News: SK Hynix is accelerating the development of 3D stacked DRAM, a next-generation DRAM technology regarded as essential for edge AI. The company has recently launched a talent recruitment initiative and plans to collaborate with U.S. customers to co-design the technology. 3D stacked DRAM is a next-generation semiconductor technology that stacks memory chips directly on top of logic semiconductors (system semiconductors). Industry experts anticipate that this technology will become a core semiconductor solution for edge AI devices in the post-generative AI era of physical AI. SK Hynix is currently recruiting 3D stacked DRAM design engineers through its U.S. subsidiary in San Jose to advance R&D in this area. Click the link below to join Dongcha Beating · Feishu AI News Channel, which provides 24/7 monitoring of global AI trends and news. (Source: BlockBeats)
Source:Show original
Disclaimer: The information on this page may have been obtained from third parties and does not necessarily reflect the views or opinions of KuCoin. This content is provided for general informational purposes only, without any representation or warranty of any kind, nor shall it be construed as financial or investment advice. KuCoin shall not be liable for any errors or omissions, or for any outcomes resulting from the use of this information. Investments in digital assets can be risky. Please carefully evaluate the risks of a product and your risk tolerance based on your own financial circumstances. For more information, please refer to our Terms of Use and Risk Disclosure.