Odaily Planet Daily reports that SK Hynix is considering outsourcing part of its Base Die orders for the seventh-generation HBM product, HBM4E, to Intel’s foundry services to establish a multi-supplier ecosystem, reduce reliance on TSMC, and strengthen its pricing negotiation power. Currently, the HBM4 Base Dies produced by SK Hynix are manufactured using TSMC’s 12nm-class process. (Herald Economy)
SK Hynix Considers Intel for HBM4E Base Die Production
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Summary
On-chain news reveals that SK Hynix is considering outsourcing the production of HBM4E Base Dies to Intel for wafer manufacturing, beginning with the seventh-generation HBM product. The move aims to diversify supply chains and reduce dependence on TSMC. SK Hynix currently uses TSMC’s 12nm-level process for mass-produced HBM4 Base Dies. Crypto price movements remain sensitive to such supply chain developments.
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