Samsung to Double HBM4 Series Production in 2025

According to ChainCatcher, citing the Seoul Economic Daily, Samsung Electronics plans to more than double its production of HBM4 and HBM4E series memory in 2025 compared to this year. The company intends to increase its outsourced cleaning volume of glass carriers required for thinning HBM DRAM from 20,000 wafers per month this year to 50,000 wafers per month next year—an increase of 2.5 times. Last year, monthly demand for these carriers was approximately 10,000 wafers, and this year it has already doubled. Samsung’s primary focus for expansion lies in HBM4 and HBM4E products featuring 12 or more layers. The company began mass production and shipment of HBM4 in February this year, utilizing sixth-generation 10nm-class (1c) DRAM and 4nm process substrate chips, and delivered 12-layer HBM4E samples to customers such as NVIDIA in May. Industry estimates project that Samsung’s HBM capacity, measured by monthly wafer starts, will rise from approximately 180,000 this year to around 250,000 next year—an increase of nearly 40%. The share of HBM4 series shipments is expected to rise from approximately 40% this year to about 80% next year.