Odaily Planet Daily report: South Korean semiconductor company Samsung Electronics is refining its investment plan for a large-scale semiconductor production base in South Korea, aiming to build four new wafer fabs by 2030, and has already shared the related proposals with key partners.
Samsung Electronics plans to build two new fabs in Pyeongtaek (P5 and P6), one fab in the Nam-saek邑 semiconductor cluster in Yongin, and one new fab in Gwangju. SK Hynix is expected to construct two new fabs (Y1 and Y2) in the Won-sam semiconductor cluster in Yongin and one new fab in Gwangju. Together, the two companies will build a total of seven new fabs between now and 2030.
On the 29th of last month, Samsung Electronics and SK Hynitz announced a total semiconductor equipment investment roadmap of 320 trillion won, excluding AI data center investment costs. Samsung Electronics advanced its target completion date for the Hwaseong wafer plant from 2047 to 2040, while SK Hynitz moved its target from 2045 to 2033.
Industry professionals in the semiconductor equipment sector say that Samsung Electronics recently inquired whether its partners are interested in making additional investments in Gwangju, contingent on plans to build a wafer fab there before 2030; however, the feasibility remains uncertain given current capacity and Gwangju’s infrastructure.