Samsung Electro-Mechanics and LG Innotek Join Intel’s EMIB-T Substrate Supply Chain

ChainCatcher report, according to ZDNet Korea on the 9th, Samsung Electro-Mechanics and LG Innotek are advancing into the supply chain for EMIB-T packaging substrates used by Intel, with product development and testing already underway. EMIB connects chips using small silicon bridges, previously utilized by Intel primarily for its own chips; the improved EMIB-T is now being expanded for external sales. Google’s next-generation AI accelerator, TPU, set to launch in the second half of next year, will be the first to adopt EMIB-T. EMIB-T incorporates silicon vias within the silicon bridge for power delivery. According to insiders, Samsung Electro-Mechanics has been developing EMIB substrate samples for years and is currently advancing EMIB-T supply based on the 2.1D packaging substrate concept. LG Innotek recently delivered EMIB-T packaging substrates to SK Hynix for sample testing, with both parties installing HBM onto the substrates to evaluate product characteristics. Currently, EMIB-T packaging substrates are supplied by Japan’s Ibiden, Shin-Etsu Chemical, Taiwan’s Unimicron, and Austria’s AT&S. Ibiden has decided to utilize its idle facilities to construct a dedicated mass-production line for Intel’s EMIB-T substrates, with an investment of approximately 2 trillion KRW, and is reportedly already receiving advance payments from Google, Amazon, Intel, and others.