ME News reports that on September 28 (UTC+8), NVIDIA CEO Jensen Huang will meet again in New York with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Choi Tae-won. This marks their second meeting in approximately two months since their July encounter in San Francisco, as Samsung Electronics accelerates its collaboration with NVIDIA in this field. According to business sources on the 27th, Lee Jae-yong and Choi Tae-won plan to attend the Korean Association’s annual dinner in New York at 6 p.m. on the 28th, where Huang will be present as the recipient of this year’s Van Fleet Award. The industry’s primary focus for this meeting is high-bandwidth memory (HBM). Sources indicate that Kim Yong-hyun, Vice Chairman of Samsung Electronics’ Device Solutions Division, met with Huang during his visit to Korea in June, where they discussed long-term collaboration on next-generation HBM technologies such as HBM4E and HBM5. The New York meeting may also cover foundry services and advanced packaging—areas where Samsung holds a competitive advantage. It is reported that Kim and Huang also discussed cooperation on next-generation foundry technologies during their June meeting. (Source: BlockBeats)
NVIDIA’s Huang to Meet with Lee and Choi in New York, Focusing on HBM Collaboration
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NVIDIA CEO Jensen Huang is scheduled to meet with Samsung Electronics Chairman Lee Jay-yong and SK Group Chairman Choi Tae-yong in New York on September 28, 2026. Following their July discussion in San Francisco, the meeting will focus on HBM4E and HBM5. Samsung is enhancing its on-chain news collaboration with NVIDIA. Wafer fabrication and advanced packaging may also be discussed. While new token listings remain a key topic for crypto platforms, this meeting centers on hardware partnerships.
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