San Jose, California, October 13, 2026 /PRNewswire/ — MSI is showcasing its open data center and AI infrastructure at the 2026 OCP Global Summit (Booth A49), featuring the next-generation 21-inch ORv3 system and DC-MHS modular building blocks, NVIDIA MGX racks and GPU server platforms, and the XpertStation WS300 desktop AI supercomputer based on the NVIDIA DGX Station architecture. The ORv3 system is designed for higher-density air- and liquid-cooled deployments, while the DC-MHS HPM portfolio expands modular platform options to include AMD and Intel architectures. NVIDIA MGX racks and server platforms enable scalable accelerated computing within data centers, and the XpertStation WS300 is tailored for local AI development.
Danny Hsu, General Manager of MSI Enterprise Platform Solutions, said: “Infrastructure requirements are rapidly evolving as customers need to balance higher compute density, AI growth, and new thermal patterns. Our focus is on providing them with greater flexibility through open standards and modular platforms, enabling them to adapt as workloads evolve.”
21-inch ORv3 system based on DC-MHS and equipped with AMD EPYC 9006 series server CPUs
MSI is expanding its 21-inch ORv3 product line with a dual-node platform based on DC-MHS, featuring AMD EPYC 9006 series server processors, supporting up to 600W TDP per node. The system offers both 2U air-cooled and 1U direct-to-chip liquid-cooled configurations, combined with 48V bus power delivery, PCIe 6.0 connectivity, and memory speeds of up to 8,000 MT/s for RDIMMs and 12,800 MT/s for MRDIMMs, designed for data center deployments.
Each node supports two PCIe 6.0 x16 expansion slots and front-access NVMe storage, delivering high-speed I/O and flexible scalability for data-intensive workloads. Paired with DC-SCM-based management, these platforms provide operators with a consistent ORv3 foundation while enabling scalable thermal density to meet deployment requirements.
- CD281-S4091-X2: A 2U dual-node air-cooled platform featuring 16 DDR5 DIMM slots per node and eight front-accessible E1.S PCIe 6.0 NVMe drive bays, providing increased local storage for high-density computing deployments while maintaining standard air cooling. Suitable for workloads such as front-end web services, cloud services, and content delivery infrastructure.
- CD182-S6091-X2: A 1U dual-node direct-to-chip liquid-cooled platform, featuring 32 DDR5 DIMM slots per node and four front-accessible E1.S PCIe 6.0 NVMe drive bays, with optional additional E1.S storage to achieve higher compute density and memory capacity in less rack space.
DC-MHS HPM covering M-FLW, M-DNO, and M-SDNO architectures
MSI’s DC-MHS HPM product portfolio supports M-FLW, M-DNO Type 4, M-DNO Type 2, and M-SDNO form factors, and is compatible with AMD EPYC 9006 series server processors and Intel Xeon 6/6+ processors. This HPM line provides system designers with a unified DC-MHS foundation across board size, processor, and server configuration options.
- AMD DC-MHS HPM: D6082, D4091, and D4081 support M-FLW and M-SDNO designs, compatible with AMD EPYC 9006 series server processors. The full product lineup supports PCIe 6.0, up to 32 DDR5 DIMM slots, and M-RDIMM speeds of up to 12,800 MT/s, covering both full-width and high-density optimized server designs.
- Intel DC-MHS HPM: D5062, D3066, D3071, and D3061 support the M-FLW, M-DNO Type 4, and M-DNO Type 2 form factors. The D3071 adds support for Intel Xeon 6900E+ processors with 12-channel memory and MRDIMM speeds up to 8,800 MT/s, while the broader product lineup supports PCIe 5.0 and OCP 3.0 networking for diverse server configurations.
Scalable AI infrastructure covering rack, server, and desktop deployments
In addition to the OCP product portfolio, MSI has launched a broader range of AI infrastructure products, including NVIDIA MGX rack-scale systems, standalone NVIDIA MGX servers, and desktop AI supercomputers based on the NVIDIA DGX Station platform. This portfolio addresses diverse deployment needs—from centralized accelerated computing infrastructure to on-premises AI development—supported by liquid cooling, high-speed networking, and flexible GPU configurations for various scales and workloads.
- NVIDIA MGX Rack: A 48RU rack configuration featuring four MSI CG681-S6093 liquid-cooled NVIDIA MGX systems, NVIDIA Spectrum-4 SN5600 data switching, and SN2201 out-of-band networking, providing an integrated foundation for rack-scale accelerated computing deployments.
- CG681-S6093: A 6U liquid-cooled NVIDIA MGX platform supporting up to eight NVIDIA RTX PRO 6000 Blackwell Server Edition liquid-cooled GPUs, featuring dual AMD EPYC 9006 series server processors, eight 400G NVIDIA ConnectX-8 ports, PCIe 6.0 expansion, and up to 32 DDR5 DIMM slots, designed for high-density AI and accelerated computing workloads.
- CG290-S3063: A 2U NVIDIA MGX platform supporting up to four GPUs, including the NVIDIA H200 NVL, NVIDIA RTX PRO 6000, and NVIDIA RTX PRO 4500 Blackwell Server Edition, offering a compact solution for GPU-accelerated AI deployments prioritizing rack density and configuration flexibility.
- XpertStation WS300: A desktop AI supercomputer powered by the NVIDIA GB300 Grace Blackwell Ultra Desktop Superchip, featuring up to 748 GB of unified memory and dual 400GbE networking via NVIDIA ConnectX-8 SuperNIC. The system supports both Linux and Windows environments, offering developers greater flexibility within their familiar AI development workflows. Two XpertStation WS300 units can be clustered together to scale AI workloads beyond a single machine, enabling local prototyping, fine-tuning, and large-scale AI model and agent inference.