IT Home, October 22: Micron held its 2026 Technology Webinar yesterday local time, providing outlooks on DRAM, broad HBM, NAND, and SSD. This article focuses on stacked integrated broad HBM memory products.
Micron expects two new types of 3D stacked memory, vHBM and vEIM, to arrive by 2028, when standard HBM5 is expected to launch.
vHBM can be understood as a 3D-integrated version of HBM, featuring vertically stacked DRAM dies, a base die, and an XPU logic chip, which further shortens data communication paths, improves bandwidth efficiency, and reduces power consumption. vHBM can also coexist with standard 2.5D HBM.
vEIM is structurally similar to vHBM but is designed specifically for edge AI inference scenarios, with its first-generation product targeting 2 TB/s bandwidth and energy efficiency below 1 pJ/bit.
To achieve vHBM and vEIM, Micron plans to apply bumpless hybrid bonding technology and integrate thermal management solutions.