Odaily Planet Daily reports that Micron plans to make significant equipment investments before the end of the year to enhance production capacity for its latest-generation HBM—HBM4 12-layer products. This move aims to address its current shortfall in HBM production capacity compared to Samsung Electronics and SK Hynix, thereby increasing its market share. Micron intends to add up to 60,000 wafers per month in HBM capacity by the end of this year. Last year, Micron’s HBM output was approximately 40,000 to 50,000 wafers per month, meaning its HBM capacity will more than double compared to last year.
A person familiar with the situation said: "Micron is making substantial equipment investments to rapidly increase HBM4 production capacity. By the end of this year, Micron is expected to have an HBM capacity of approximately 100,000 wafers per month." (Korean ETNews)
