Micron Aims to Expand HBM Production to 100,000 Wafers Per Month by Year-End

ME News reports that on September 4 (UTC+8), Micron plans to double its high-bandwidth memory (HBM) production capacity compared to last year, with a potential addition of up to 60,000 wafers per month by the end of this year. According to sources, Micron’s HBM output last year was approximately 40,000 to 50,000 wafers per month, and is expected to reach around 100,000 wafers per month by year-end to narrow the gap with Samsung Electronics and SK Hynix. Micron is increasing procurement orders from multiple HBM equipment suppliers, with manufacturing primarily based in Taiwan and Singapore fabs, continuously ramping up equipment deployment. Current production is dominated by HBM3E 12-layer, with HBM4 12-layer accounting for approximately 20% to 30% at the beginning of the year, potentially rising to as high as 50% by year-end. The HBM4 12-layer will be used in NVIDIA’s latest AI accelerator, Vera Rubin, which Micron began mass-producing in the second quarter of this year. In June, Micron CEO Mehrotra stated on the Q3 fiscal year 2026 earnings call that the ramp-up speed of HBM4 12-layer is approximately twice that of HBM3E 12-layer, and cumulative revenue from HBM4 shipments has exceeded $1 billion. Industry estimates suggest Samsung and SK Hynix each have HBM capacities of approximately 150,000 to 200,000 wafers per month. Counterpoint data shows that in Q2 this year, global HBM market share stood at 50% for SK Hynix, 32% for Samsung, and 18% for Micron. Micron is also preparing related investments in Hiroshima, Japan. (Source: ChainCatcher)