MediaTek Launches Dimensity 9600 Pro with 2nm Process and 3.3 Billion Transistors

Huo Xing Finance reports that on September 15, MediaTek unveiled its next-generation flagship chip, the Dimensity 9600 Pro, at its 2026 Dimensity Flagship New Product Launch event. According to the official announcement, the chip is built on TSMC’s 2nm process and features over 33 billion transistors. It employs a fused computing architecture that seamlessly integrates heterogeneous computing cores—including CPU, GPU, NPU, and ISP—centered around an AI-powered engine. The chip features a full-big-core design, equipped with dual ultra-big cores C2-Ultra at 4.55GHz, three big cores C2-Pro at 4.35GHz, and three big cores C2-Pro at 3.1GHz, along with 34.5MB of combined L2+L3+system cache, supporting LPDDR6 memory and UFS 5.0 storage. Compared to the Dimensity 9500, the ultra-big core power consumption has decreased by 37%, and multi-core power consumption has dropped by 61%. In GeekBench V6.4 benchmarks, it scores 4,276 in single-core and 12,650 in multi-core, representing approximately a 17% improvement in single-core and 15% in multi-core performance over the Dimensity 9500. The NPU features a dual-NPU architecture with the APU 1090, delivering a 51% increase in peak performance. MediaTek claims to have ranked as the world’s No.1 smartphone SoC vendor by market share for six consecutive years.