San Jose, California, USA, October 15 /PRNewswire/ — LITEON Technology (2301.tw) has been invited to attend the NVIDIA MGX Ecosystem Ceremony held during the 2026 OCP Global Summit. Representing LITEON are John Chang, General Manager of the LITEON Cloud Infrastructure Platform and Solution SBG; Bob Weng, General Manager of the AIDC Platform SBU; and Simon Ong, President of LITEON USA. The ceremony brought together NVIDIA and global ecosystem partners to celebrate the ongoing evolution of the AI infrastructure ecosystem.
During the 2026 OCP Global Summit, LITEON also showcased the NVIDIA 800 VDC Power Rack and 800V-to-50V Power Brick at the NVIDIA MGX ecosystem booth, highlighting its key technological capabilities in next-generation AI power infrastructure. These solutions encompass rack-level power architecture and high-efficiency power conversion technologies, designed to meet the efficiency and scalability demands of AI data centers through high efficiency and high power density. These solutions help establish a robust and scalable power foundation for the development of AI factories.
LITEON has long been a partner in the NVIDIA MGX ecosystem, consistently investing in innovations in power and thermal management. Through NVIDIA MGX’s modular architecture, LITEON helps customers accelerate deployment from single-node servers to rack-scale systems. In recent years, LITEON has frequently been invited to NVIDIA MGX ecosystem events, reflecting the long-standing partnership and LITEON’s strategic role in the AI infrastructure ecosystem.
John Chang, General Manager of LITEON Cloud Infrastructure Systems & Platforms SBG, said: “As the scale and power density of AI workloads continue to grow, the transformation of data center power architectures is accelerating. Leveraging our expertise in power management and system integration, LITEON is deepening our collaboration with NVIDIA and ecosystem partners. From rack-level power architectures to server-level power conversion technologies, we are jointly building efficient, scalable AI infrastructure to support the next generation of AI factories.”
As AI computing demands continue to grow rapidly, data centers are evolving toward higher power densities and megawatt-scale deployments. In addition to showcasing its complete 800 VDC power architecture and thermal management solutions, LITEON has set up an interactive virtual rack experience at its booth, demonstrating deployment scenarios at 330 kW, 880 kW, and 1.2 MW power levels. This demonstration illustrates the evolution of data center energy architecture from single-rack deployments to megawatt-scale AI computing environments, highlighting LITEON’s end-to-end capabilities spanning from rack-level power and thermal management to data center-scale energy infrastructure. Looking ahead, LITEON will continue to collaborate closely with NVIDIA and ecosystem partners to accelerate the adoption of 800 VDC architectures and next-generation energy infrastructure, delivering more efficient and resilient power solutions for megawatt-scale AI data centers.