Kulicke & Soffa wins SEMI North America Award for breakthrough in fluxless thermocompression bonding technology
This recognition highlights the company’s leadership in advancing heterogeneous integration and AI-driven semiconductor innovation.
Fort Washington, Pennsylvania, October 13, 2026 /PRNewswire/ — Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC, referred to herein as “Kulicke & Soffa,” “K&S,” or the “Company”) today announced that it has been selected as the 2026 SEMI North America Award recipient. This award is one of the highest honors in the semiconductor industry, recognizing institutions for outstanding technical and commercial contributions to semiconductor manufacturing.
This award recognizes Kulicke & Soffa’s groundbreaking formic acid in-situ bonding technology—an innovative fluxless thermo compression (FTC) solution that addresses critical interconnect scaling challenges and is actively driving the development of next-generation heterogeneous integration architectures for artificial intelligence, high-performance computing, and advanced photonics applications.
The award was presented during the CEO Summit keynote at the SEM Token Issuance N West, highlighting the growing adoption and importance of K&S’s advanced packaging portfolio, including its industry-leading APTURA™ platform.
Raj Talluri, CEO of Kulicke & Soffa, said: “As semiconductor performance today depends heavily on advanced packaging and heterogeneous integration, the industry’s ability to increase interconnect density efficiently and cost-effectively has never been more critical. We are honored to receive this recognition from SEMI. This award reflects the creativity, dedication, and relentless execution of our global team, who continuously develop innovative solutions to help our customers overcome the most complex manufacturing challenges in the industry.”
Traditional hot compression bonding typically requires a flux cleaning step after bonding, a process that becomes increasingly challenging with finer interconnect pitches. Meanwhile, hybrid bonding solutions, while highly capable, may introduce significant manufacturing complexity and cost. Kulicke & Soffa states that its proprietary flux-free hot compression bonding technology combines advanced plasma pre-cleaning with in-situ formic acid oxide reduction, enabling high-yield, ultra-fine-pitch interconnects while simplifying the manufacturing process and reducing production costs.
The company stated that FTC technology has become a foundational component of its advanced packaging roadmap, enabling customers to achieve interconnect pitches below 10 micrometers while supporting applications in wafer-level, substrate-level, and panel-level manufacturing environments.
John Molnar, Vice President and General Manager of Advanced Solutions, said: “This recognition validates our innovation-driven strategy of selecting differentiated technologies that address real customer challenges. By delivering performance approaching hybrid bonding levels through more manufacturable methods, we are accelerating the adoption of advanced packaging solutions required for next-generation AI, high-performance computing, silicon photonics, and other rapidly growing semiconductor markets.”
The company stated that this award further solidifies Kulicke & Soffa’s position as a leading supplier of semiconductor interconnection solutions. The company’s advanced packaging portfolio includes thermocompression bonding, hybrid bonding enablement technologies, wedge bonding, and vertical interconnect solutions, supporting some of the most complex heterogeneous applications in the industry.
The company stated that as semiconductor complexity continues to rise, interconnect and packaging innovations have become essential to achieving system-level performance across the entire semiconductor industry. This award highlights Kulicke & Soffa’s pivotal role in shaping the future of the industry.
About Kulicke & Soffa
Kulicke & Soffa is a global leader in semiconductor assembly technologies, driving performance improvements in devices for the automotive, computing, industrial, storage, and communications markets. Founded in 1951, K&S is innovation-driven and uniquely positioned to address increasingly dynamic process challenges by aligning technology with opportunity to create and deliver long-term value.
About SEMI
SEMI® is a global industry association connecting over 4,000 companies and 1.5 million professionals across the semiconductor and electronic design and manufacturing supply chain. Through policy advocacy, workforce development, sustainability, supply chain management, and other initiatives, SEMI accelerates collaboration among its members to address major industry challenges and find solutions. Its SEMICON trade shows and events, technology communities, standards, and market intelligence help drive member growth and innovation in design, devices, equipment, materials, services, and software—enabling smarter, faster, and safer electronic products.
Contact Information
Kulicke & Soffa
Marilyn Sim
Public Relations
Phone: +65-6880-9309
Kulicke & Soffa
Joseph Elgindy
Investor Relations
Phone: +1-215-784-7500