International Business Machines Corporation announced a research collaboration with Siemens Energy AG on Wednesday to advance IBM's next-generation nanostack semiconductor architecture. The collaboration aims to combine IBM's semiconductor capabilities with Siemens' expertise in electronic design automation, process simulation, lithography optimization and advanced manufacturing software. The collaboration aims to accelerate development of manufacturing and design capabilities for future nanostack generations beyond the current node. The initiative aims to shorten technology development cycles and scale the architecture for commercial manufacturing.
IBM launched the nanostack architecture in June. The three-dimensional, nanosheet-based design enables manufacturers to fit more computing power into smaller chips. The current 7 angstrom node accommodates nearly 100 billion transistors on a 150-square-millimeter chip, almost double the density of IBM's 2nm node chip. The current node offers 50% better performance and 70% more energy efficiency, as well as 40% scaling in SRAM memory.
IBM Vice President of Silicon Technology R&D Huiming Bu said the three-dimensional nanostack approach represents the path forward for logic scaling over the coming decade. Bu said that scaling is needed to support AI and other emerging technologies. IBM aims to move the complex nanostack architecture closer to production. The architecture can address the industry's rising power demands and future AI computing demand. Reuters reported that IBM said earlier in June that production could begin within five years.
IBM is scheduled to report quarterly earnings on October 21, 2026. Analysts expect earnings per share of $2.87, compared with $2.65 a year earlier. Revenue is projected to reach $16.82 billion, up from $16.33 billion. IBM stock carries a Buy rating with an average price forecast of $256.94.
RBC Capital maintained an Outperform rating and a $270.00 target on October 13. Truist Securities initiated coverage with a Hold rating and a $240.00 target on October 9. Susquehanna had a Neutral rating and raised the target to $235.00 on August 31.
Benzinga Pro data showed IBM shares up 0.36% at $231.60 during premarket trading on Wednesday.
IBM and Siemens Collaborate on 3D Chip Tech for AI Advancement
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Summary
AI + crypto news: IBM and Siemens have joined forces to develop 3D chip technology for AI advancement. The collaboration focuses on IBM's nanostack semiconductor architecture, combining IBM's chip design with Siemens' EDA and manufacturing tools. IBM's 7 angstrom node offers 50% better performance and 70% more energy efficiency than the 2nm node. On-chain news continues to highlight hardware innovation as a key enabler for next-gen computing.
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