Google TPU Adopts Intel EMIB Packaging, MediaTek Deepens Collaboration

ChainCatcher report, according to DIGITIMES, the Taiwanese semiconductor supply chain indicates that advanced packaging technologies are moving toward diversification, with Intel’s EMIB emerging as a key option. Google’s TPU has confirmed the adoption of EMIB packaging; the first TPU using this technology has achieved target yield rates, meeting Google’s original standards in terms of technology, cost, and production capacity. The likelihood of future TPU generations continuing to use EMIB has significantly increased. Amid ongoing tight capacity for TSMC’s CoWoS, Google will continue adopting EMIB as long as its yield and technology remain at target levels. MediaTek, as a key ASIC partner, benefits from smoother collaboration due to some of its U.S. team leaders having Intel backgrounds. Although MediaTek still relies primarily on TSMC, its successful cooperation with Intel on TPU helps strengthen Google’s trust, secure additional projects, and offer cloud customers diversified packaging solutions. Previously, at its earnings call, TSMC called for more suppliers to invest in advanced packaging to alleviate pressure. The supply chain generally believes TSMC’s own capacity expansion has limits, making diversified packaging pathways—such as Intel’s—essential. Related test equipment and interface providers are also expected to benefit.