DRAM and HBM capacity for 2027 is fully booked, with AI demand driving 70% allocation.

Huo Xing Finance reports, according to DIGITIMES, industry insiders have revealed that the three major memory manufacturers have already completed capacity allocation negotiations for the full year of 2027, with all DRAM and HBM capacity sold out. For NAND Flash, although demand is not as tight as DRAM, capacity is expected to be fully booked by the end of August 2026. Adata Chairman Chen Li-bai confirmed that HBM and AI server-related applications will account for nearly 70% of DRAM capacity, leaving relatively limited supply for PC and smartphone DRAM. Industry analysts estimate that Samsung, Micron, and SanDisk’s full-year 2027 NAND capacity has also been pre-sold out, with Kioxia and SK Hynix expected to confirm their allocations by the end of August. SK Group Chairman Choi Tae-won previously stated that AI semiconductor demand in 2027 is projected to increase by 60–100% compared to 2026, with memory demand expected to rise by 50–60%, potentially widening the supply-demand gap and leading to the “most severe shortage in history.” Industry insiders note that capacity allocation in 2027 is more orderly than in 2026, but manufacturers typically offer only 60–70% of customer demand, leaving some smaller buyers with no access to supply. Memory price increases may slow in 2027, but persistently high levels are likely to become the new norm.