CyberTAN Technology, Inc. unveiled the blueprint for its Pallas series liquid-cooled 102.4 Tbps Ethernet switch platform at the OCP Global Summit 2026, stating that it is collaborating with Marvell to develop a fully liquid-cooled 102.4 Tbps T100 Ethernet switch platform blueprint.
This enterprise network equipment provider has launched a new Pallas series 1.6T Ethernet switch platform architecture designed to support the Marvell® Teralynx® T100 102.4 Tbps switching chip, while delivering industry-leading power usage effectiveness (PUE).
CyberTAN states that as generative AI and hyperscale workloads expand rapidly, data centers require innovations in chip efficiency and rack-level thermal management. The Pallas series platform is fully optimized for Marvell’s 3nm T100 architecture, maximizing the chip’s 25% energy-saving advantage while increasing port density. By combining Marvell’s chip design with CyberTAN’s proprietary Direct-to-Chip (D2C) liquid cooling engineering, the platform is designed to handle over 1,000 watts of localized heat dissipation and help data centers achieve higher levels of environmental sustainability.
GwongYih Lee, Chairman and CEO of CyberTAN, said: “Our collaboration with Marvell marks a key milestone in bringing a mass-producible 1.6T connectivity architecture to market. By designing the Pallas series around Marvell’s T100 chip specifications, we are enabling hyperscale cloud providers worldwide with high-density, low-latency network switch designs that push the boundaries of PUE optimization and thermal management.”
Rishi Chugh, Vice President and General Manager of Marvell’s Cloud Switching Business Unit, said: “Marvell is committed to building an open and robust infrastructure ecosystem for the AI era. The Pallas series platform architecture of CyberTAN demonstrates how the industry is designing systems to leverage the immense bandwidth and energy efficiency of our 3nm T100 chip to overcome traditional network bottlenecks.”
At the OCP 2026 event, attendees can visit Booth B29 to learn about CyberTAN’s pre-development switch platform. The on-site demonstration features an integrated architecture prototype, including a complete schematic chassis, optical enclosure, and internal wiring, configured with dedicated thermal modules to simulate T100 chip workloads. Visitors can also observe a dynamic liquid cooling flow demonstration driven by a coolant distribution unit (CDU), equipped with multiple temperature sensors to validate the platform’s ability to safely handle 40W OSFP ZR/ZR+ optical modules at a liquid inlet temperature of 45°C, achieving an industry-leading PUE of 1.1.
About CyberTAN Technology, Inc.
CyberTAN Technology, Inc., founded in 1998, is a global manufacturer of broadband access and advanced network infrastructure, headquartered in Taiwan with operations worldwide. CyberTAN specializes in enterprise switches, wireless connectivity solutions, and next-generation AI data center hardware architectures, committed to delivering sustainable, low-latency, and high-efficiency networking products to global hyperscale cloud providers, telecom operators, and enterprise customers through green technologies and advanced engineering capabilities.