CXMT Launches Shanghai Plant Equipment Tender and Plans Multi-Location Expansion

ChainCatcher report: China’s largest DRAM manufacturer, CXMT, has recently initiated equipment bidding for its new Shanghai facility and is advancing capacity expansion across multiple locations. CXMT is currently mass-producing DRAM at its Phase II facility in Hefei and Phase I facility in Beijing, with estimated output of approximately 200,000 medium-wafer equivalents per month, expected to exceed 300,000 per month by year-end. CXMT plans to launch its new Shanghai factory in the fourth quarter of this year, with equipment bidding already underway. Semiconductor equipment industry insiders indicate that the Shanghai plant is planned for two-phase expansion, with capacity set to significantly surpass 100,000 wafer equivalents per month. Subsequent plans include launching a new Hefei factory in the first half of next year, and potentially a new Beijing factory as early as the second half of next year, followed by another Hefei facility in the first half of the following year. Equipment industry sources note that CXMT has already engaged with multiple parties regarding the timing of these facility expansions. If all plans are executed, CXMT could add at least 70,000 to 80,000 wafer equivalents per month annually from this year through 2028, with long-term capacity potentially exceeding 600,000 wafer equivalents per month. Samsung Electronics and SK Hynix currently have estimated DRAM capacities of approximately 700,000 and 600,000 wafer equivalents per month, respectively.