BlockBeats news, on August 4, according to Reuters, sources familiar with the matter said that CXMT is considering building a second 12-inch DRAM wafer fab in Beijing's Yizhuang District and is in discussions with the Beijing Economic-Technological Development Area and several state-owned technology companies regarding financing. The company is seeking at least RMB 600 million (approximately $89 million) in support, but negotiations are still in early stages, and the financing amount and structure may be adjusted.
The proposed factory will be located at the site of CXMT’s existing Beijing DRAM wafer fab. The planned production capacity and total investment have not yet been determined, but constructing a wafer fab capable of producing advanced DRAM typically requires over $10 billion. Currently, CXMT operates two 12-inch DRAM wafer fabs in Hefei and one in Beijing, each with a monthly capacity of approximately 100,000 wafers.
ChangXin Memory is currently building new factories in Shanghai and Hefei; once these projects are fully operational, the company’s monthly production capacity could double to over 600,000 wafers. This expansion comes at a time when demand for AI infrastructure, data centers, and consumer electronics is driving memory chips into an upward cycle. Last month, the company completed an $8.6 billion IPO, the largest semiconductor listing in mainland China to date, and its stock price has since risen by 13%.
Inotek is currently the world's fourth-largest DRAM manufacturer, but Samsung Electronics, SK Hynix, and Micron collectively still account for nearly 90% of the global market share in the first quarter. Beijing and Shanghai are also providing financial and other support to Inotek to capture the economic and strategic benefits of its expansion.