ChainCatcher reports that ASML plans to collaborate with its key customers to develop new solutions capable of producing the most advanced chip manufacturing equipment to meet the demands of large data center chips designed by companies such as NVIDIA. Currently, ASML’s widely used extreme ultraviolet (EUV) lithography machines can produce chips with a maximum area of approximately 800 square millimeters. ASML’s upcoming next-generation “high-numerical-aperture” EUV lithography machines will enable the production of even more precise chips. However, due to their use of smaller masks, these machines are currently limited in the maximum chip area they can produce. ASML plans to demonstrate a pilot production line using larger masks by 2031 and achieve large-scale manufacturing capability with this new technology by 2033.
ASML to Develop Next-Generation EUV Lithography for Large Data Center Chips
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Summary
ASML plans to develop next-generation EUV lithography to support large data center chips, as inflation data remains a key factor in global tech investment. The company will collaborate with major clients, including NVIDIA, to advance chip production. Current EUV machines can handle chips up to 800 square millimeters, but the new high-numerical-aperture models will offer greater precision. ASML aims to test a pilot line with larger reticles by 2031 and achieve mass production by 2033, amid ongoing shifts in inflation data affecting supply chains.
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