Apple COO visits Zhengzhou, reviews iPhone foldable phone production

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Apple COO Sabih Khan visited Zhengzhou on October 12, 2026, and toured Foxconn’s production line for the iPhone Duo foldable phone. He also inspected Yutong Technology’s plastic-free Apple packaging. Foxconn and the Zhengzhou Airport Economic Zone formed a joint venture, Henan Hongchuang Technology, with 2 billion yuan in capital. The company focuses on high-end components and achieved 100 billion yuan in production value during its first phase. On-chain news and crypto news continue to track major tech and supply chain developments.
CoinMarketCap reports:

IT Home, October 12: Today, Ge Yue, General Manager of Apple Greater China, shared that Apple’s Chief Operating Officer, Sabih Khan, visited Zhengzhou and interacted with Foxconn employees in Zhengzhou.

Sabeeh Khan also visited Yutong Technology. It was reported that through joint efforts, both parties achieved the goal of removing plastic from all Apple product packaging.

According to Henan Daily, on October 11, Sabeeh Khan and蒋集恒, Acting CEO and Group General Manager of Foxconn Technology Group, visited the Foxconn Zhengzhou Comprehensive Bonded Zone to inspect "black tech" applications on production lines and in Apple iPhones, and personally tested an iPhone Duo foldable phone on-site.

IT Home reports that by the end of 2025, Foxconn, in partnership with the state-owned asset platform of the Zhengzhou Aviation Port Economic Comprehensive Experimental Zone, established Henan Hongchuang Technology Co., Ltd. This is Foxconn’s first state-owned enterprise joint venture in Zhengzhou, with a registered capital of RMB 2 billion, focused on the research, development, and manufacturing of high-end electronic components. Production began in July this year, with the first phase expected to generate cumulative output worth up to RMB 100 billion.

“Henan Hongchuang has mastered the sputtering process and has already applied it to the production of the iPhone 18 Pro series and iPhone Duo,” said Jiang Jiheng. The company has pioneered the direct application of electromagnetic shielding sputtering technology onto the SoC package surface, replacing traditional metal shields, reducing module thickness by 20%, and significantly improving heat dissipation performance.

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