Big Brother has returned, and I feel everything has come back! Previously, it was mentioned that Intel’s EMIB-T was poised to steal customers from TSMC. Now, it appears TSMC is preparing to strike back. Reports indicate that TSMC is reportedly developing a new advanced packaging technology similar to Intel’s EMIB, with a clear goal: to prevent Intel from capturing customers in the AI large-chip packaging market. Why is TSMC in such a hurry? Because customers have already begun seeking second sources. According to reports, TSMC’s advanced process and packaging capacity remains tight; both Google and NVIDIA are evaluating Intel as a backup supplier; SK Hynix is testing whether HBM can reliably work with Intel’s packaging technology. MediaTek is even supporting both Intel and TSMC simultaneously. In the past, discussions about Intel centered on CPUs or presidential orders. Now, its advanced packaging capabilities are finally gaining market recognition. Advanced packaging is transitioning from a supporting role to the main stage.