ChainThink reports that Samsung Electronics has begun constructing a die-to-wafer hybrid bonding production line at its Pyeongtaek P5 facility, targeting advanced packaging for next-generation HBM and logic semiconductors.
In terms of equipment, Samsung has selected the Netherlands-based Besi and plans to purchase approximately 50 hybrid bonding machines, each costing around 6 billion Korean won (approximately $4.3 million)—about twice the price of competitors. Negotiations have progressed slowly due to Samsung’s requirements for customized modifications to the equipment architecture;
Meanwhile, Besi also supplies TSMC and Micron, so it is being cautious about modifying its equipment solely for Samsung. Samsung is also evaluating local alternative solutions; its subsidiary SEMES has completed the development of a D2W hybrid bonding machine and has already delivered samples for validation earlier this year.
Hanwha Semitech completed the development of its second-generation "SHB2 Nano" in February and delivered samples to SK Hynix in April.
Citrini analyst Jukan said the technology is expected to be used in NVIDIA’s next-generation AI accelerator, Feynman, which will feature custom HBM;
Samsung internally expects the relevant technology to achieve large-scale application around 2029 to 2030.