Samsung Electronics is building a die-to-wafer hybrid bonding production line at its Pyeongtaek P5 facility, planning to purchase approximately 50 hybrid bonding machines from Besi, each priced at around 6 billion KRW. This technology replaces traditional thermo-compression bonding with hybrid copper bonding, primarily targeting custom HBM applications. Citrini analyst Jukan stated that hybrid bonding is expected to be used in NVIDIA’s next-generation AI accelerator, Feynman, which employs custom HBM, with Samsung anticipating large-scale adoption between 2029 and 2030.
Samsung Builds Hybrid Bonding Line for NVIDIA Feynman Accelerator
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Summary
Samsung is constructing a die-to-wafer hybrid bonding line at its Pyeongtaek P5 facility to support NVIDIA’s Feynman AI accelerator. The company will purchase approximately 50 machines from Besi, each costing 6 billion KRW. The new copper hybrid bonding process is specifically designed for custom HBM. AI and crypto news highlight this development as a critical advancement in next-generation chip manufacturing. Citrini analyst Jukan noted that the technology will be implemented in Feynman, with mass production anticipated between 2029 and 2030.
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