BlockBeats news: On June 11, Ming-Chi Kuo, an analyst at Tien Feng International Securities in Hong Kong, posted that TSMC’s next-generation advanced packaging technology, CoPoS, is expected to enter mass production in the second half of 2028. Designed specifically for ultra-large packages exceeding 9.5 times the mask size, NVIDIA’s Feynman AI chip may become its first adopter.
CoPoS employs a glass core substrate structure, sandwiching glass between ABF build-up layers, using glass carriers and panels of specific dimensions—neither as a glass interposer nor as a replacement for ABF—with chips bonded onto the ABF surface, clarifying several industry misconceptions.
Public information shows that CoPoS offers a larger panel platform and more space, making it ideal for integrating CPO optical components such as optical engines and couplers. Future high-end AI packaging may combine CoPoS (large substrate) with CPO (optical I/O) to form a complete solution.