Samsung phân bổ hơn 50% công suất 4nm cho các chip nền HBM4

The Huoxing Finance report states that Samsung Electronics' foundry division has recently surpassed 50% allocation of its 4-nanometer process capacity to mass production of HBM4 base chips. Industry sources indicate that the division will dedicate more than half of its 4-nanometer wafers this second half of the year to HBM4 base chip manufacturing to meet increased demand from NVIDIA, Broadcom, AMD, and others. Samsung began mass shipments of HBM4 in February this year and plans to expand supply starting in the third quarter, significantly increasing wafer input from mid-year onward. The chip is based on Samsung Foundry’s 4-nanometer (SF4) process. As of last month, over 50% of its total 4-nanometer capacity has been allocated to HBM4 base chips. Sources say Samsung’s 4-nanometer production is currently at full capacity, with HBM4 base chips accounting for approximately 50% to 60%, a proportion expected to remain high in the second half of the year. Samsung’s foundry lines at Pyeongtaek Plant 2 and 3 are mass-producing 4- to 7-nanometer processes, with 4-nanometer capacity estimated at approximately 30,000 wafers per month, implying around 15,000 wafers per month dedicated to HBM4 base chips. During its second-quarter earnings call, Samsung stated that it expects HBM4 revenue to more than triple quarter-over-quarter in the third quarter, with HBM4 revenue accounting for over 60% of the company’s total HBM revenue in the second half of the year.