Dung lượng DRAM và HBM cho năm 2027 đã được đặt kín, nhu cầu AI thúc đẩy phân bổ 70%

The Huoxing Finance report, citing DIGITIMES, reveals that industry insiders have disclosed that the three major memory manufacturers have already completed negotiations for their full-year 2027 capacity allocations, with DRAM and HBM capacities fully sold out. For NAND Flash, although not as tight as DRAM, capacity is expected to be fully reserved by the end of August 2026. Adata Chairman Chen Li-bai confirmed that HBM and AI server-related applications will account for nearly 70% of DRAM capacity, leaving relatively limited supply for PC and smartphone DRAM. Industry analysts assess that the full-year 2027 NAND capacity from Samsung, Micron, and SanDisk has also been pre-sold out, with Kioxia and SK Hynix expected to confirm their allocations by the end of August. SK Group Chairman Choi Tae-won previously stated that AI semiconductor demand in 2027 is projected to increase by 60-100% compared to 2026, with storage demand estimated to rise by 50-60%, potentially leading to a continued widening supply-demand gap and possibly the "most severe shortage in history." Industry insiders note that capacity allocation in 2027 is more orderly than in 2026, but manufacturers typically offer only 60-70% of customer demand, leaving some smaller buyers still unable to secure supply. Memory price increases may slow in 2027, but persistently high levels could become the new norm.