Everyone thinks Terafab is trying to build a 2nm foundry from scratch. They are wrong. The equipment they are actively sourcing (TC bonders, hydrogen annealing tools, test sockets) points to one specific target: Advanced Packaging. Musk knows building a leading edge fab is a decade long money pit. The real bottleneck for custom AI chips like Dojo is no longer the silicon substrate. It is 2.5D and 3D chiplet integration. Terafab is playing a much smarter game: 1. Buy base wafers from Intel or TSMC as a commodity. 2.Vertically control the final and most critical assembly phase in house. Do not build the whole stack. Just own the bottleneck. That is how you win at hardware.