CoWoS TSMC: Capacity will expand from 35K wafers/month at the end of 2024 to 130K wafers/month by the end of 2026 (nearly a fourfold increase), yet demand still exceeds supply. NVIDIA accounts for approximately 60% (595K wafers/year), with AMD, Google, and others competing for the remaining share. Outsourcing: ASE and Amkor handle subcontracted CoWoS subprocesses from TSMC; advanced packaging revenue is expected to double by 2026. Intel’s EMIB/Foveros serves as an alternative solution.
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