Brother Master has returned, and I feel everything has come back! Previously, it was mentioned that $INTC’s EMIB-T was preparing to steal customers from $TSM, but now it seems $TSM is ready to strike back. Rumors indicate that $TSM is reportedly developing a new advanced packaging technology similar to Intel’s EMIB, with a clear goal: to prevent Intel from taking away customers in the AI large-chip packaging market. Why is $TSM in such a hurry? Because customers have already started looking for second suppliers. According to reports, TSMC’s advanced process and packaging capacity remain tight; both Google and NVIDIA are evaluating Intel as a backup supplier; SK Hynix is also testing whether HBM can reliably work with Intel’s packaging technology. MediaTek has even begun supporting both $INTC and $TSM simultaneously. In the past, discussions about Intel revolved around CPUs or presidential orders. Now, its advanced packaging capabilities are finally gaining recognition from the market. Advanced packaging is transitioning from a supporting role to the main stage.
园长｜YuanManBagikan
Sumber:Tampilkan versi asli
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